core technologies
Low Temperature Co-Fired Ceramic
Low Temperature Co-Fired Ceramic (LTCC) is a multilayer ceramic substrate which enables miniaturization through capability of embedding passive components, fine conductor pitch and width, capability for grooves and cavities, and superior thermal and high frequency performance.
ColdFusion provides customized and standard packaging solutions to cater to customer who requires RF and thermal packaging.
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LTCC Design Rules
- LTCC Design Guidelines [ Download Document ]
Standard package offerings:
- Hermatic Packaging [ Download Document ]
- 2.4Ghz Chip Antenna [ Download Document ]
Standard LED carrier:
- LED Packaging Datasheet [ Download Document ]
Please contact us for your customized solutions.
A patent pending thermal substrate solution utilizing aluminum as a substrate which has electrical connections directly embedded onto the surface. [more]
Fully Filled Thermal Via Solution-
Key Highlights
- Minimun Conductor Line Pitch and Width: 100/100um
- Minimum Via Diameter: 100um
- Flatness: 60um for area of 3inch
- Surface Roughness: >10um pk-pk
- Thermal Conductivity: >400W/mk (with thermal via)
- Loss Tangent: 0.002
- Maximum Substrate Thickness: 2000um (2cm)
- Substrate Cost Drivers: Thickness(z dimension), length (y dimension) and width(x dimension) of a product
- Maximum Substrate Size: 175mmx175mm (8”x8” bar size)
- Conductor System: Mixed Metal (silver and gold)
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